No. |
Technical parameters |
Technical index |
1 |
Processor |
⑴ 1 个 Processor, distributed architecture for each Processor ⑵ ⑶ provide 3.6GFLOPS processing capabilities within 24M bits Signal Processor chip Memory
⑷ Integrated 14-channel DMA controller, and four 1GByte / sec full-duplex communication port LVDS Link Port |
2 |
Memory |
⑴ Processor provides 256MB SDRAM
⑵ node provides 16MB Flash for program load-host environment ⑵ maximum data transfer speed of 200 MHz
⑶ has separate read and write ports, can read and write independently |
3 |
FPGA (optional one) |
⑴ FPGA1 provide 8 million logic design resources, can provide the ability to 560KB of on-chip memory, while also providing 80 XtremeDSP Slices digital signal processing unit ⑵ FPGA2 provide 5 million logic design resources, can provide the ability to 384KB of on-chip memory, while 512 XtremeDSP Slices also provides a digital signal processing unit, it may be applied Broadband High speed signal processing in real-time |
4 |
A / D |
⑴ sampling rate of up to 500MSPS High speed A / D converter, the channel can be flexibly configured, it can work in single-channel, low-power ⑵ 1 个 High speed AD channel, the maximum sampling rate of 500M, quantization bits 14BIT |
5 |
D / A |
⑴ onboard sampling rate of up to 1.2GSPS High speed D / A converters, 14-bit quantization to ensure high stray recovery signal ⑵ 1 个 High speed DA channel, the maximum sampling rate of 1.2G, quantization bits 14BIT |
6 |
CPCI interface |
32 66M CPCI interface, the peak transmission speed of up to 256MB / S |
7 |
Other communication port |
USB2.0 interface, network interface, RS422 interface and DSP LINK interface |
8 |
Size |
233mm * 160mm (6U CPCI) |
9 |
Working temperature |
-40 ℃ ~ 80 ℃ |