No. |
Technical parameters |
Technical index |
1 |
Memory |
⑴ onboard memory capacity of 2 capacity of 36MBit the QDR-II + SRAM
⑵ maximum data transfer speed of 600 MHz
⑶ has separate read and write ports, can read and write independently |
2 |
FPGA |
⑴ FPGA logic design to provide five million resources, can provide 480KB of on-chip storage capacity, while also providing 50 XtremeDSP Slices digital signal processing unit ⑵ rich High speed data communication interface, 24 对 RocketIO Transceiver, to meet the real-time High speed data transmission Functions |
3 |
A / D |
⑴ sampling rate of up to 3.4GSPS High speed A / D converter, the channel can be flexibly configured, it can work in single-channel, low power consumption ⑵ 1 个 High speed AD channel, the maximum sampling rate of 3.4G, quantization bits 8BIT |
4 |
D / A |
⑴ onboard sampling rate of up to 4.5GSPS High speed D / A converters, 12-bit quantization to ensure high stray recovery signal ⑵ 1 个 High speed DA channel, the maximum sampling rate of 4.5G, quantization bits 12BIT |
5 |
CPCI interface |
32 66M CPCI interface, the peak transmission speed of up to 256MB / S |
6 |
Other communication port |
24 pairs of RocketIO Transceiver; High speed real-time data will be transmitted to the 3.4G analysis and processing on a dedicated digital Signal processing board |
7 |
Size |
233mm X 160mm (6U CPCI) |
8 |
Working temperature |
-40 ℃ ~ 80 ℃ |